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Manufacturing of micro-devices and processing technology
  • Method and process for manufacturing MEMS
    CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of application serial number 62 / 481,635 filed on April 4, 2017 under 35usc119 (e), which is incorporated herein by reference in its entirety. The present invention relates to mems, and more specifically to wafer bonding of mems. Micro-electro-mechanical systems (mems) such as motion sensors, internal sensors, and movable mirrors are widely used. As we all know, mem ...
  • Manufacturing method of miniature flow path device
    The present disclosure relates to a miniature flow path device. A device (hereinafter referred to as a “micro flow path device”) having a flow path with a micrometer-scale width called a micro flow path defined by a plurality of flow path members is known. For example, Japanese Patent No. 5700460 and Japanese Patent No. 5771962 disclose a cell culture device for culturing cells in a microchannel or a structure using a microchannel device as a microchannel chip. and...
  • Method and process for improving flatness of polyimide sacrificial layer in radio frequency MEMS switch
    The invention belongs to a method for preparing a polyimide sacrificial layer, and particularly relates to a method for improving the flatness of a polyimide sacrificial layer in a radio frequency mems switch. Compared with traditional mechanical and electronic switches, RF mems switches have the advantages of small size, light weight, low power consumption, small insertion loss, high isolation, high frequency bandwidth, good linearity and high integration, and can be widely used. In phase shifters, attenuators, filters, antennas and other RF devices, ...
  • Preparation method and process of microfluidic device
    This application is a divisional application of an invention application with an "application number: 201810771605.9, the filing date is July 13, 2018, and an invention name: a microfluidic device, a preparation method thereof, and a microfluidic system. The invention relates to the field of microfluidics, in particular to a method for preparing a microfluidic device. The traditional methods of preparing microfluidic devices include 3D direct writing / printing technology, microfluid injection technology, imprint technology, and laser processing ...
  • Microfluidic device and microfluidic system manufacturing method
    This application is a divisional application of an invention application with an "application number: 201810771605.9, the filing date is July 13, 2018, and an invention name: a microfluidic device, a preparation method thereof, and a microfluidic system. The invention relates to the field of microfluidics, in particular to microfluidic devices and microfluidic systems. Traditional microfluidic device preparation methods mainly include 3D direct writing / printing technology, microfluid injection technology, imprint technology and laser ...
  • Microfluidic device and preparation method thereof, microfluidic system and process
    The invention relates to the field of microfluidics, in particular to a microfluidic device, a preparation method thereof, and a microfluidic system. The traditional methods for preparing microfluidic devices include 3D direct writing / printing technology, microfluid injection technology, embossing technology, and laser processing technology. However, the 3D direct writing / printing technology cannot achieve good water and oxygen barrier and packaging, and it is easy to form a metal oxide layer on the surface; the microchannel injection process is complicated, and the patterning and channel configuration are relatively limited ...
  • MEMS chip with TSV structure and wafer level hermetic sealing method and process
    The invention relates to a process method for mems wafer-level air-tight packaging, in particular to a mems chip with a tsv structure and a wafer-level air-tight packaging method, which belong to chip packaging. The mems (micro-electro-mechanicalsystem) chip usually has a movable structure, which is very fragile and needs to be protected by a sealed cavity packaging method. The traditional packaging method ...
  • Amplitude detection, amplitude adjustment and direction detection of a swinging body
    Examples of the present invention relate to an apparatus and method for detecting a swing amplitude of a swing body, adjusting a swing amplitude of the swing body, and / or detecting a swing direction of the swing body, the swing body swinging about a swing axis. Examples of the invention relate to mems elements (mems = microelectromechanicalsystem = mikro-elektro-mechanischessystem ...
  • Double-response gold nanofilm based on SPR conversion, preparation method, application and process thereof
    The invention relates to a two-dimensional nano material, in particular to a dual-response gold nano film based on spr conversion, a preparation method and application thereof, and belongs to the two-dimensional nano material. Nanomaterials have attracted great attention from researchers due to their unique volume effects, surface interface effects, and quantum size effects. Two-dimensional precious metal nanomaterials (such as two-dimensional gold nanoparticle single-layer films) exhibit specific electrical properties due to the integration effect between particles ...
  • Composite SERS substrate and preparation method, application and process thereof
    The invention relates to micro-nano structure processing, in particular to a composite sers substrate, a preparation method and application thereof. In agricultural production, in order to increase the yield of crops, a large number of pesticides are used to kill insects, sterilize and kill harmful animals (or weeds). The loss of these pesticides to the environment will cause serious environmental pollution, and the pesticide residues of the crops themselves are potentially harmful to the health of consumers. Currently used to detect pesticide residues in food ...
  • Method and process for improving stability of underwater air layer on super-hydrophobic surface
    The invention relates to a super-hydrophobic surface, and in particular, to a method for improving the stability of an underwater air layer of a super-hydrophobic surface. Super-hydrophobic surfaces have important applications in anti-fouling, drag reduction and anti-icing of underwater hulls. Among them, the stability of the underwater air layer on super-hydrophobic surfaces is the most critical factor for its function. When the super-hydrophobic surface is underwater, fluid flow, static pressure and soaking time will accelerate the diffusion and even loss of the air ...
  • Process method and process for implementing MEMS laminated device microwave port
    The invention belongs to a micro-electromechanical system package, in particular to a process method for implementing a microwave port of a mems stacked device. In RF micro-systems, multi-domain devices or chips such as active chips, passive integrated devices (ipd), bulk acoustic wave devices (fbar), and micro-electro-mechanical system (mems) sensors are integrated in a three-dimensional stacking manner. The lead of the test port is generally through the through silicon via (TSV) by using a tap ...
  • MEMS sensor element, corresponding sensor, chip, and manufacturing method and process thereof
    The invention relates to a mems sensor element having a diaphragm that is arranged in an offset manner. The invention also relates to a mems sensor. The invention also relates to a chip having at least one mems sensor element. The invention also relates to a method for producing a mems sensor element with a displaceable diaphragm. Although the present invention can generally be applied to any sensor having a sensor element with a displaceable diaphragm ...
  • Electronic skin and preparation method and process thereof
    The invention relates to electronic components, in particular to an electronic skin and a preparation method thereof. The electronic skin itself is an ultra-thin stretchable film, so it is attached to the film substrate and human skin during preparation and use. However, in the process of using, especially in the process of transferring the electronic skin layer from the film substrate to human skin, the film without the substrate is very easy to bend, fold, and it is difficult to spread on the skin surface. Summary of the invention
  • Eutectic bonding method using ALGe
    CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of application serial number 62 / 481,634 filed on April 4, 2017 under 35usc119 (e), the contents of which are incorporated herein by reference in their entirety. The present invention relates to wafer bonding, and more particularly, to eutectic bonding for sealing mems devices. Micro-electro-mechanical systems (mems) (for example, motion sensors and movable mirrors) are widely used ...
  • Manufacturing method of micro-electromechanical fluid device module
    This case relates to a MEMS module, especially a MEMS fluid device module utilizing a novel packaging method to improve the efficiency of the MEMS fluid device. With the rapid development of science and technology, the traditional fluid conveying device has been moving toward the direction of miniaturizing the device and maximizing the flow rate. It is also becoming more and more diversified in applications, and it can be seen in industrial wearables, biomedical applications, medical care, and electronic cooling to the most recent wearable devices. In recent years, microcomputers ...
  • Microfluid actuator manufacturing method
    This case relates to an actuator, in particular to a microfluidic actuator made of a micro-electromechanical semiconductor film. At present, in various fields, whether in the pharmaceutical, computer technology, printing, energy and other industries, the products are developing towards miniaturization and miniaturization. Among them, micropumps, sprayers, inkjet heads, industrial printing devices and other products contain fluids that cause Actuator is its key technology. With the rapid development of science and technology, the application of fluid transport structure has become more and more diversified, for example ...
  • Preparation method and process of anti-interference MEMS device
    The invention relates to micromechanical electronics, in particular to a method for preparing an anti-interference mems device. Mems (micro-electro-mechanicalsystems) is an abbreviation of micro-electro-mechanical systems. Mems manufacturing technology uses micro-nano processing technology, especially related technologies for semiconductor wafer manufacturing, to produce various micro-nano-level mechanical structures, combined with dedicated control integrated circuits (As ...
  • Preparation method and process of carbon nanotube parallel array
    The present application relates to a semiconductor, and more particularly, to a method for preparing a parallel array of carbon nanotubes. Carbon nanotubes, also known as bucky tubes, are one-dimensional quantum materials with special structures (radial dimensions are on the order of nanometers, axial dimensions are on the order of micrometers, and both ends of the tube are basically sealed). The traditional disordered reticulated carbon nanotube film cannot take advantage of the one-dimensional anisotropy of carbon nanotubes, which makes the carriers transport in the carbon nanotube film ...
  • Manufacturing method of anti-interference MEMS device
    The invention relates to micromechanical electronics, in particular to an anti-interference mems device. Mems (micro-electro-mechanicalsystems) is an abbreviation of micro-electro-mechanical systems. Mems manufacturing technology uses micro-nano processing technology, especially related technologies for semiconductor wafer manufacturing, to produce various micro-nano-level mechanical structures, combined with dedicated control integrated circuits. (Asic), group ...
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